Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11349110 | Method for forming lead-carbon compound interface layer on lead-based substrate | Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Bo-Shun Wang +1 more | 2022-05-31 |