Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11500153 | Multi-chip packaging of silicon photonics | Roy Meade, Chong Zhang, Haiwei Lu | 2022-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11500153 | Multi-chip packaging of silicon photonics | Roy Meade, Chong Zhang, Haiwei Lu | 2022-11-15 |