Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527493 | Method for preparing semiconductor device structure with air gap structure | — | 2022-12-13 |
| 11315871 | Integrated circuit device with bonding structure and method of forming the same | — | 2022-04-26 |
| 11309263 | Semiconductor device structure with air gap structure and method for preparing the same | — | 2022-04-19 |
| 11264474 | Semiconductor device with boron nitride layer and method for fabricating the same | — | 2022-03-01 |