Issued Patents 2022
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521916 | Method for fabricating semiconductor device with etch stop layer having greater thickness | — | 2022-12-06 |
| 11502038 | Semiconductor structure having via through bonded wafers and manufacturing method thereof | — | 2022-11-15 |
| 11502025 | Semiconductor device with etch stop layer having greater thickness and method for fabricating the same | — | 2022-11-15 |
| 11476200 | Semiconductor package structure having stacked die structure | — | 2022-10-18 |
| 11469210 | Semiconductor package with multiple coplanar interposers | — | 2022-10-11 |
| 11469173 | Method of manufacturing a semiconductor structure | — | 2022-10-11 |
| 11462453 | Semiconductor device with protection layers and method for fabricating the same | Tse-Yao Huang | 2022-10-04 |
| 11450556 | Semiconductor structure | Chih-Ching Lin | 2022-09-20 |
| 11355464 | Semiconductor device structure with bottle-shaped through silicon via and method for forming the same | Tse-Yao Huang | 2022-06-07 |
| 11342333 | Semiconductor device | Tse-Yao Huang | 2022-05-24 |
| 11329028 | Semiconductor device with recessed pad layer and method for fabricating the same | — | 2022-05-10 |
| 11322458 | Semiconductor structure including a first substrate and a second substrate and a buffer structure in the second substrate | — | 2022-05-03 |
| 11315904 | Semiconductor assembly and method of manufacturing the same | — | 2022-04-26 |
| 11315869 | Semiconductor device with decoupling unit and method for fabricating the same | Tse-Yao Huang | 2022-04-26 |
| 11309312 | Semiconductor device | — | 2022-04-19 |
| 11309254 | Semiconductor device having through silicon vias and method of manufacturing the same | — | 2022-04-19 |
| 11302608 | Semiconductor device with protection layers and method for fabricating the same | Tse-Yao Huang | 2022-04-12 |
| 11302629 | Semiconductor device with composite passivation structure and method for preparing the same | — | 2022-04-12 |
| 11289370 | Liner for through-silicon via | Sheng-Fu Huang | 2022-03-29 |
| 11282781 | Semiconductor device and method for fabricating the same | Tse-Yao Huang | 2022-03-22 |
| 11251128 | Semiconductor device structure with air gap for reducing capacitive coupling | — | 2022-02-15 |
| 11239217 | Semiconductor package including a first sub-package stacked atop a second sub-package | — | 2022-02-01 |
| 11222811 | Semiconductor device structure with air gap and method for forming the same | — | 2022-01-11 |
| 11217525 | Semiconductor structure and method of forming the same | Sheng-Fu Huang | 2022-01-04 |