Issued Patents 2022
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515312 | Memory cell and method for reading out data therefrom | — | 2022-11-29 |
| 11515388 | Semiconductor device with P-N junction isolation structure and method for fabricating the same | — | 2022-11-29 |
| 11482490 | Semiconductor device with branch type programmable structure and method for fabricating the same | — | 2022-10-25 |
| 11469175 | Semiconductor device with programmable unit and method for fabricating the same | Tse-Yao Huang | 2022-10-11 |
| 11456353 | Semiconductor structure and manufacturing method thereof | Ting-Cih KANG | 2022-09-27 |
| 11456206 | Semiconductor structure and method of manufacturing the same | — | 2022-09-27 |
| 11424124 | Method of forming a patterned hard mask and method of forming conductive lines | Chien-Chung Wang | 2022-08-23 |
| 11404384 | Interconnect structure | Ting-Cih KANG | 2022-08-02 |
| 11342307 | Semiconductor structure and manufacturing method thereof | Yi-Jen Lo | 2022-05-24 |
| 11322216 | Fuse array structure | Ting-Cih KANG, Chiang-Lin Shih | 2022-05-03 |
| 11315918 | Semiconductor structure and semiconductor layout structure | — | 2022-04-26 |
| 11309282 | Method for manufacturing a semiconductor package having five-side protection | — | 2022-04-19 |
| 11307249 | Method for characterizing resistance state of programmable element | Ting-Cih KANG, Wei Li | 2022-04-19 |
| 11270962 | Semiconductor device and method of manufacturing the same | Chiang-Lin Shih, Pei-Jhen Wu, Ching-Hung Chang | 2022-03-08 |
| 11257694 | Semiconductor device having hybrid bonding interface, method of manufacturing the semiconductor device, and method of manufacturing semiconductor device assembly | — | 2022-02-22 |
| 11217560 | Die assembly and method of manufacturing the same | Chiang-Lin Shih, Pei-Jhen Wu, Ching-Hung Chang | 2022-01-04 |