Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476172 | Radio frequency module | Yoshihito Otsubo | 2022-10-18 |
| 11398436 | Module having sealing layer with recess | Akihiro Fujii | 2022-07-26 |
| 11297746 | High-frequency module | Yoshihito Otsubo | 2022-04-05 |