HW

Houng-Chi Wei

XC Xiamen Sanan Integrated Circuit Co.: 1 patents #1 of 7Top 15%
Overall (2022): #429,258 of 548,613Top 80%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11264231 Method for manufacturing backside metalized compound semiconductor wafer Tsung-Te CHIU, Bing-Han CHUANG 2022-03-01