Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11357112 | Molded interconnect device | Tsuey Choo CHANG, Steven Zeilinger, Patrick L. Riley, SukMin KANG | 2022-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11357112 | Molded interconnect device | Tsuey Choo CHANG, Steven Zeilinger, Patrick L. Riley, SukMin KANG | 2022-06-07 |