HS

Hideo Sakai

DI Diamet: 2 patents #3 of 8Top 40%
Overall (2022): #154,552 of 548,613Top 30%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11498127 Device and method for manufacturing multilayer molded article Tsuneo Maruyama, Shinichi Takezoe 2022-11-15
11446737 Molding die and molding method Tsuneo Maruyama, Yoshiki Tamura 2022-09-20