Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11487205 | Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element | Hiroko Wachi, Yasuhisa Kayaba, Hirofumi Tanaka | 2022-11-01 |
| 11332643 | Adhesive member and production method for adhesive member | Jun Kamada, Tomoya Matayoshi, Michio Eriguchi, Kaichiro Haruta, Takashi UNEZAKI +1 more | 2022-05-17 |