Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257735 | Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate | Kazuhiko Yamasaki, Tatsuya Numa, Masayuki Ishikawa | 2022-02-22 |