Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11466123 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki, Seiji Shika | 2022-10-11 |
| 11447658 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Takuya Suzuki, Seiji Shika, Yune Kumazawa | 2022-09-20 |