Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217445 | Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device | Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Youichi Nakajima | 2022-01-04 |