Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482462 | Power semiconductor device with first and second sealing resins of different coefficient of thermal expansion | Taishi Sasaki, Yuki YOSHIOKA, Hiroyuki Harada | 2022-10-25 |
| 11476170 | Power semiconductor module and power conversion apparatus | Hisayuki Taki, Seiki Hiramatsu | 2022-10-18 |