Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502022 | Heatsink, and semiconductor module including the heatsink | Shigenobu Tochiyama, Yuhei Nagashima | 2022-11-15 |
| 11446751 | Soldering system including temperature distribution measurement control device, control method, and program | Takashi Kobayashi, Nobuyasu Kitagawa, Tsuyoshi Tanabe | 2022-09-20 |