Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322430 | Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin | Hodaka ROKUBUICHI, Kiyofumi Kitai, Yasuyuki SANDA | 2022-05-03 |