Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335629 | Transfer-mold type power module and lead frame | Fumihito KAWAHARA, Yuji SHIKASHO | 2022-05-17 |
| 11244836 | Semiconductor apparatus, power conversion device, and method for manufacturing semiconductor apparatus | — | 2022-02-08 |