Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502066 | Red flip chip light emitting diode, package, and method of making the same | — | 2022-11-15 |
| 11495586 | High efficiency chip-on-board light-emitting diode | Peng Chen, Zhengqing Gan | 2022-11-08 |
| 11469350 | Ultrathin solid state dies and methods of manufacturing the same | Martin F. Schubert | 2022-10-11 |
| 11466827 | Linear LED module | — | 2022-10-11 |
| 11448381 | Light-emitting device with reflective ceramic substrate | Jesus Del Castillo, Scott West | 2022-09-20 |
| 11415272 | High efficiency LEDs and LED lamps | Michael A. Tischler, David Keogh | 2022-08-16 |
| 11387101 | Methods of manufacturing engineered substrate structures for power and RF applications | Cem Basceri, Shari Farrens | 2022-07-12 |
| 11355680 | LED array package | Scott West, Cem Basceri, Zhengqing Gan | 2022-06-07 |
| 11335557 | Multi-deposition process for high quality gallium nitride device manufacturing | Cem Basceri | 2022-05-17 |
| 11328927 | System for integration of elemental and compound semiconductors on a ceramic substrate | Cem Basceri, Shari Farrens, Ozgur Aktas | 2022-05-10 |
| 11271101 | RF device integrated on an engineered substrate | Cem Basceri, Ozgur Aktas | 2022-03-08 |
| 11245058 | Light emitting diode constructions and methods for making the same | R. Scott West | 2022-02-08 |
| 11233179 | Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods | Martin F. Schubert | 2022-01-25 |
| 11222874 | Discontinuous patterned bonds for semiconductor devices and associated systems and methods | Scott D. Schellhammer, Jeremy S. Frei | 2022-01-11 |