Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515204 | Methods for forming conductive vias, and associated devices and systems | Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins +2 more | 2022-11-29 |
| 11482492 | Assemblies having conductive interconnects which are laterally and vertically offset relative to one another | Radhakrishna Kotti, David A. Kewley, Dave Pratt | 2022-10-25 |
| 11328749 | Conductive interconnects and methods of forming conductive interconnects | David A. Kewley, Dave Pratt, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani | 2022-05-10 |