Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502006 | Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure | Ryota Suzuki, Makoto Sato | 2022-11-15 |