Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488963 | Method of forming a semiconductor device | Yoshitaka Nakamura | 2022-11-01 |
| 11217588 | Integrated assemblies comprising voids between active regions and conductive shield plates, and methods of forming integrated assemblies | Hiroaki Taketani | 2022-01-04 |