Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444088 | Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillars | Hong Li, Ramaswamy Ishwar Venkatanarayanan, Sanh D. Tang | 2022-09-13 |