Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538726 | Method for forming packaged semiconductor die with micro-cavity | Matthias Klein, Richard Gruenwald | 2022-12-27 |
| 11244876 | Packaged semiconductor die with micro-cavity | Matthias Klein, Richard Gruenwald | 2022-02-08 |