Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11470736 | Potted electronic module with improved adhesion of potting compound | Henryk Frenzel, Dietmar Huber, Jakob Schillinger, Jörg Möstl, Karl-Heinz Scherf | 2022-10-11 |
| 11260492 | Apparatus for machining a workpiece | — | 2022-03-01 |