Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485670 | Hermetic conductive feedthroughs for a semiconductor wafer | Michael S. Sandlin | 2022-11-01 |
| 11419552 | Sealed package and method of forming same | Craig L. Schmidt | 2022-08-23 |