Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495510 | Semiconductor device package structure and method for fabricating the same | Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495510 | Semiconductor device package structure and method for fabricating the same | Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang | 2022-11-08 |