Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467357 | Emitter module | Cailin WEI, Prasad Yalamanchili | 2022-10-11 |
| 11398446 | Method and material for attaching a chip to a submount | Zhengwei Shi, Lijun ZHU | 2022-07-26 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467357 | Emitter module | Cailin WEI, Prasad Yalamanchili | 2022-10-11 |
| 11398446 | Method and material for attaching a chip to a submount | Zhengwei Shi, Lijun ZHU | 2022-07-26 |