Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11503700 | Thermal management in circuit board assemblies | — | 2022-11-15 |
| 11417441 | Method of interconnecting nanowires, nanowire network and transparent conductive electrode | Byung Hoon Lee, Chee Lip Gan, Yeng Ming Lam | 2022-08-16 |
| 11274224 | Ink composition, method for forming a conductive member, and conductive device | Zhenggang Li, Yeng Ming Lam, Chee Lip Gan, Jaewon Kim | 2022-03-15 |