Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508703 | Light emitting device for monitoring system | Yu-Yu Chang, Chien-Shun Huang | 2022-11-22 |
| 11456405 | Chip bonding region of a carrier of light emitting package and manufacturing method thereof | Chih-Yuan Chen | 2022-09-27 |
| 11437355 | Light-emitting package structure and manufacturing method thereof | Chien-Feng Kao, Wen-Hsiang Lin | 2022-09-06 |
| 11307085 | Light detecting device, lighting module, and manufacturing method for the same | Wen-Hsiang Lin, Yung-Chang Jen, Shih-Chung Huang | 2022-04-19 |
| 11296064 | Substrate structure with buried chip and light emitting device using the same | Tsung-Kang Ying, ERH-CHAN HSU | 2022-04-05 |