Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498245 | Dip-molded article, latex composition for dip-molding and preparation method thereof | Seung Whan Oh, Yong Seok Jung, Jung Eun Kim, Sang Jin Shin | 2022-11-15 |
| 11492466 | Latex composition for dip molding, a method of preparing the same, and molded article therefrom | Seung Uk Yeu, Seung Whan Oh, Yong Seok Jung, Jung Su Han | 2022-11-08 |