Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539090 | Pouch case, pouch type secondary battery and manufacturing method thereof | Hee Gyoung Kang | 2022-12-27 |
| 11539089 | Pouch-type secondary battery and battery module comprising the same | Jae Man Seo, Jeong Sam Son, Gyu Jin Chung | 2022-12-27 |
| 11523921 | Multifunctional bioimplantable structure and method of preparing the same | So Ri Lee, Ji Yeon Lee, Gyo Yeon Hwang | 2022-12-13 |
| 11499898 | Anisotropic mechanical expansion substrate and crack-based pressure sensor using the anisotropic substrate | Byeong Hak PARK | 2022-11-15 |
| 11482747 | Pouch-type secondary battery | Jin Go KIM, Seung Noh Lee | 2022-10-25 |
| 11429510 | Electronic apparatus for verifying code and method thereof | Prakash Kadel, Dae Hwan Bae, Ki Woong Jang | 2022-08-30 |
| 11378472 | Multi-type pressure sensor | Chanho Jeong | 2022-07-05 |
| 11276893 | Pouch secondary battery and method of fabricating the same | Dong Ju Kim, Sung Yeop KIM, Jin Go KIM, Seung Noh Lee | 2022-03-15 |
| 11251479 | Pouch case and secondary battery using the same | Sung Yeop KIM, Won Seok JEONG | 2022-02-15 |
| 11245141 | Secondary battery module | Seung Hoon JU, Kwan Yong Kim, Dong Ju Kim, Sung Yeop KIM, Jin Go KIM +1 more | 2022-02-08 |
| 11243913 | System and methods for pre-populating service data indication on user interface | Ku Kang, Jungjoon Park, Duhyeong Kim, Ki Woong Jang, Prakash Kadel +6 more | 2022-02-08 |
| 11240918 | Method for flip-chip bonding using anisotropic adhesive polymer | Ju-Seung Lee | 2022-02-01 |