Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329097 | Semiconductor device having a first pad not overlapping first connection electrodes and a second pad not overlapping second connection electrodes in a thickness direction | Woo Sik Lim, Jae Won Seo, Jin Kyung Choi, Youn Joon Sung, Jong Hyun Kim | 2022-05-10 |