Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450879 | Electrode assembly | Shin Hwa Lee, Woo Yong Lee | 2022-09-20 |
| 11358322 | Pouch molding method and apparatus | Sung Hyun Kim, Woo Yong Lee, Hyun II Kim, Byung Jun Ahn, Tae Hyun Kim +1 more | 2022-06-14 |
| 11251502 | Electrode assembly and method for manufacturing the same | Hyun Tae Kim, Byung Heon Shin | 2022-02-15 |