Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515242 | Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrate | Takahiro Sasaki | 2022-11-29 |
| 11394362 | Electronic component housing package, electronic apparatus, and electronic module | Masaki Suzuki | 2022-07-19 |
| 11388819 | Wiring board, electronic device, and electronic module | Keisuke Sawada | 2022-07-12 |