Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515285 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, JeongHo Yang, Ziauddin Ahmad | 2022-11-29 |
| 11289448 | Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops | Basil Milton | 2022-03-29 |