Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515286 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Thomas J. Colosimo, JR. | 2022-11-29 |
| 11257746 | Power distribution within silicon interconnect fabric | Boris Vaisband, Subramanian S. Iyer | 2022-02-22 |
| 11239542 | Network on interconnect fabric and integrated antenna | Boris Vaisband, Subramanian S. Iyer, Arpan Dasgupta, Arsalan Alam | 2022-02-01 |