Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373924 | Power module having heat dissipation structure | Hyun Koo Lee | 2022-06-28 |
| 11227845 | Power module and method of manufacturing same | Hyun Koo Lee, Sung Won Park, Hyeon Uk Kim | 2022-01-18 |