Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289415 | Semiconductor device including semiconductor chip having elongated bumps | Mizuho Ishikawa | 2022-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289415 | Semiconductor device including semiconductor chip having elongated bumps | Mizuho Ishikawa | 2022-03-29 |