Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257771 | High-performance integrated circuit packaging platform compatible with surface mount assembly | Philipp Pahl, John Westerman | 2022-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257771 | High-performance integrated circuit packaging platform compatible with surface mount assembly | Philipp Pahl, John Westerman | 2022-02-22 |