Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362050 | Multi-chip packing structure employing millimeter wave | Wei-Cheng Lin, Shih-Hsiu Tseng, Chien-Jen Hsiao | 2022-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362050 | Multi-chip packing structure employing millimeter wave | Wei-Cheng Lin, Shih-Hsiu Tseng, Chien-Jen Hsiao | 2022-06-14 |