Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532704 | Semiconductor device | Keiko Kawamura, Tomoko Matsudai, Yoko Iwakaji | 2022-12-20 |
| 11348822 | Support substrate, method for peeling off support substrate, and method for manufacturing semiconductor device | — | 2022-05-31 |