Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410914 | Power module | Keiichiro Matsuo, Jun Karasawa, Shinya Hayashiyama | 2022-08-09 |
| 11370180 | Ultrasonic bonding apparatus, control device and control method | Takahiro Aizawa, Takashi Ito, Masatoshi Tanabe | 2022-06-28 |
| 11292211 | Ultrasonic bonding apparatus | Takashi Ito, Takahiro Aizawa, Masatoshi Tanabe | 2022-04-05 |