Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476223 | Semiconductor device and manufacturing method thereof | Daisuke Koike | 2022-10-18 |
| 11276629 | Semiconductor device | — | 2022-03-15 |
| 11264348 | Semiconductor device having an ultrasonic bonding portion provided between a substrate and a semiconductor chip | — | 2022-03-01 |