Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11382217 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-07-05 |
| 11375624 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-06-28 |
| 11337314 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-05-17 |
| 11337315 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-05-17 |