Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11426571 | Microneedle array with composite formulation, and method for manufacturing same | Hui Suk YANG | 2022-08-30 |
| 11382841 | Microstructure using fluidization of solid, and manufacturing method therefor | Hui Suk YANG | 2022-07-12 |