Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264259 | Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method | Ryo Shimizu, Hirotaka Sazuka, Daisuke Ito | 2022-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264259 | Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method | Ryo Shimizu, Hirotaka Sazuka, Daisuke Ito | 2022-03-01 |