Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217459 | Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof | Haishen Kong, Jinxin Shen, Xinfu Liang, Qingyun Zhou | 2022-01-04 |