Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua | 2022-01-18 |