Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296017 | Thin profile power semiconductor device package having face-to-face mounted dice and no internal bond wires | — | 2022-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296017 | Thin profile power semiconductor device package having face-to-face mounted dice and no internal bond wires | — | 2022-04-05 |