Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11242619 | Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same | Chih-Hung Bai, Yao-Tsung Chen, Shih-Chun Chung | 2022-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11242619 | Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same | Chih-Hung Bai, Yao-Tsung Chen, Shih-Chun Chung | 2022-02-08 |